EVENT NEWS
IICIE 2026 · SHENZHEN
Precision RF Test Interconnects at IICIE 2026
Vinstronics is exhibiting at IICIE 2026 – International Integrated Circuit Innovation Expo,
held September 9–11, 2026 at the Shenzhen World Exhibition & Convention Center.
At Booth 14D11, we are presenting precision RF, microwave and high-speed test
interconnect solutions for semiconductor characterization, RF and millimeter-wave measurement,
high-speed PCB testing and system-level test integration.
The booth brings together key elements of the RF measurement path—from precision coaxial interfaces
and cable assemblies to multi-channel interconnects and RF probing solutions.
ON DISPLAY AT BOOTH 14D11
Four Core Test Interconnect Platforms
The exhibit focuses on interconnected product platforms supporting RF, microwave,
semiconductor and high-speed measurement environments.
01
Precision RF Connectors & Adapters
Precision coaxial interfaces for board-level, fixture, module and measurement interconnects,
including 1.0 mm, 1.85 mm, 2.4 mm, 2.92 mm, SMA and high-density push-on configurations.
Selected configurations extend to DC–110 GHz.
02
Precision RF Cable Assemblies
Low-loss, phase-stable, semi-flexible, semi-rigid/formed, ruggedized and armored cable
assemblies for VNA, laboratory, semiconductor/ATE and system-level measurement paths.
03
RF Probes & Probing Solutions
RF probing solutions for PCB, wafer and device-level characterization, including
GS / SG, GSG, GSSG, GSGSG and SS configurations for single-ended and differential measurement.
04
Multi-Channel RF Interconnects
High-density multi-channel connectors and cable assemblies for PCB, fixture and automated
test integration, including 4-, 8- and 16-channel architectures and coaxial fan-out options.
AT BOOTH 14D11
Connecting Test Requirements with Practical Interconnect Solutions
At the booth, our team is discussing application requirements directly with engineers and
test professionals across semiconductor, RF/microwave and high-speed system environments.
These conversations typically begin with the measurement frequency and interface, then extend
to cable routing, PCB conditions, channel density, probing geometry, mechanical integration
and verification requirements.
The objective is not simply to select a connector or cable, but to match the complete RF
interconnect path to the actual measurement environment.
RF PROBING DEMONSTRATION
RF Probing in a Practical Measurement Setup
The on-site probe station provides a direct view of how Vinstronics RF probes are integrated
into practical PCB, wafer and device-level characterization setups.
Probe structure, pitch, contact geometry and positioning are selected around the DUT pad layout,
measurement method and operating frequency rather than treated as independent parameters.
Both single-ended and differential probing architectures are represented within the platform.
PRODUCT & ENGINEERING PLATFORM
From Components to Application-Specific Test Interconnects
The products shown at IICIE are part of a broader engineering platform covering precision
interfaces, RF signal paths, multi-channel integration and probing.
Product selection, interface configuration, application-specific interconnect design,
prototype support and RF verification are integrated into the development process.
This allows the interconnect solution to be matched to the electrical, mechanical and
system requirements of the test application—from individual coaxial interfaces through
complete cable, multi-channel and probing configurations.
Selected RF and microwave components, including terminations and attenuators, are also
presented as part of the wider RF signal-path platform.
MEET VINSTRONICS
Visit Us at IICIE 2026
BOOTH 14D11
SHENZHEN
If you are working on semiconductor test, RF and millimeter-wave measurement,
high-speed PCB validation or custom test-system integration, visit Booth 14D11
to discuss your RF interconnect requirements with the Vinstronics team.
