Hermetic Glass-to-Metal Seal Connectors | Vinstronics
Hermetic Interconnect Series
MIL-STD-883 Qualified
Hermetic Glass-to-Metal Seal Connectors

Vacuum-tight feedthroughs engineered with 4J29 Kovar and Borosilicate Glass. Zero leakage reliability for Aerospace & Vacuum applications.

Vinstronics hermetic glass-to-metal seal connectors family including RF, multi-pin, and discrete feedthroughs for vacuum applications
10⁻⁸ Leak Rate (atm cc/s)
65GHz Max Frequency
1M+ Units Shipped
100% Helium Tested

Explore the Hermetic Connector Series

Select the connector family according to RF signal, high-density I/O, or power feedthrough requirements.

Hermetic RF

High Frequency
Hermetic SMP RF connector 50 ohm impedance matched for DC-65GHz microwave modules

50Ω impedance matched coaxial feedthroughs for microwave signal transmission (DC-65GHz).

  • DC - 65 GHz (VSWR < 1.2)
  • SMP, SMPM, SMA, 2.92mm
Request RF Quote

Multi-Pin

High Density
High density hermetic D-Sub connector MIL-DTL-24308 compatible for vacuum chamber feedthroughs

High-density headers combining multiple signal/power lines. D-Sub & Circular arrays.

  • D-Sub (MIL-DTL-24308)
  • Custom Circular Arrays
Request Multi-Pin Quote

Discrete

Power
Single pin hermetic power feedthrough terminal with solder cup for high current applications

Cost-effective individual feedthroughs and terminals for power injection & grounding.

  • Solder-in & Threaded Studs
  • High Current (Up to 20A+)
Request Discrete Quote

Engineer’s Selection Matrix

Compare the three hermetic connector families by electrical function, interface type and glass-to-metal seal construction.

Feature Hermetic RF Hermetic Multi-Pin Discrete Terminals
Primary Function High Freq Signal (50Ω) High Density I/O Power / Ground / DC
Interface Type Coaxial (SMP, SMA) D-Sub, Rectangular Pin, Stud, Wire
Glass Technology Precision Dielectric Multi-Hole Preform Single Bead

Qualified for Mission-Critical Applications

MIL-STD and industrial qualification data for vacuum-tight hermetic interconnect applications.

01

Helium Leak

Vacuum-tight sealing verified by helium leak testing.

< 1x10⁻⁸ atm cc/s
02

Thermal Shock

Temperature cycling capability for demanding environmental conditions.

-65°C to +125°C
03

Insulation

High insulation resistance for signal and feedthrough isolation.

> 5000 MΩ
04

Durability

Qualification framework aligned with hermetic electronic packaging requirements.

MIL-STD-883
Workflow

From Concept to Vacuum

Custom hermetic solutions in weeks, not months.

01

Consultation

Share your 3D models. We analyze feasibility.

02

Design

Optimization of pin layout & signal integrity.

03

Prototype

Samples in 2-3 weeks.

04

Production

Volume MFG with 100% helium leak testing.

Application Engineering

Need a Custom Hermetic Solution?

From custom pin layouts to specialized flange integration.

RF Interface Pin Layout Leak Requirement Mechanical Envelope Quantity

Request a Quick Quote