42.5 Ohm 1.85mm Jack Solderless PCB Connector DC–67 GHz VST-CPM185F-06
P/N: VST-CPM185F-06
- For 85 ohm differential launch structures
- Low-impedance design for reduced reflection
- Solderless format for repeatable board-side installation
- Well suited to high-speed data and semiconductor test
- Supports mmWave applications through 67 GHz
Engineering Note:
The VST-CPM185F-06 is a high-precision 42.5 Ω low-impedance connector engineered to suppress signal reflection in impedance-sensitive systems and is specifically matched for 85 Ω differential environments. It delivers superior phase linearity across the full DC-67 GHz spectrum, ensuring signal integrity in mission-critical millimeter-wave architectures where traditional 50 Ω components may cause mismatch.
The VST-CPM185F-06 is a high-precision 42.5 Ω low-impedance connector engineered to suppress signal reflection in impedance-sensitive systems and is specifically matched for 85 Ω differential environments. It delivers superior phase linearity across the full DC-67 GHz spectrum, ensuring signal integrity in mission-critical millimeter-wave architectures where traditional 50 Ω components may cause mismatch.
Technical Specifications
| Impedance | 42.5 ± 1 Ω |
|---|---|
| Frequency Range | DC ~ 67 GHz |
| VSWR | ≤ 1.35 |
| Material (Body) | Stainless Steel (Passivated) |
| Material (Contact) | Beryllium Copper (Gold Plated) |
| Dielectric | High-Stability PEI |
| Insulation Resistance | 5000 MΩ |
Target Applications
AI Server & High-Speed Data
Optimized for 85 Ω differential impedance systems. Ideal for testing AI server backplanes where 42.5 Ω single-ended matching is critical for signal integrity.
Optimized for 85 Ω differential impedance systems. Ideal for testing AI server backplanes where 42.5 Ω single-ended matching is critical for signal integrity.
6G & mmWave Research
Supports ultra-high frequencies up to 67 GHz, providing a stable interface for next-generation telecommunications and radar verification.
Supports ultra-high frequencies up to 67 GHz, providing a stable interface for next-generation telecommunications and radar verification.
Semiconductor Characterization
Solderless compression design enables high-speed RF testing on evaluation boards without the thermal damage or parasitics associated with soldering.
Solderless compression design enables high-speed RF testing on evaluation boards without the thermal damage or parasitics associated with soldering.
Engineering Support
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