Vinstronics VST-L-TE70FF116C-XXX 67 GHz 2×8 16-channel multi-coax cable assembly with 1.85 mm female breakouts
1.85 mm female breakout interfaces on the Vinstronics VST-L-TE70FF116C-XXX 67 GHz multi-coax cable assembly
Front detail of the Vinstronics VST-L-TE70FF116C-XXX 2×8 high-density multi-channel RF interface

67 GHz 2×8 High-Density Multi-Coax Breakout Cable Assembly, 16 × 1.85 mm Female | VST-L-TE70FF116C-XXX

P/N: VST-L-TE70FF116C-XXX

  • DC–67 GHz High-Density 16-Channel RF Interconnect
  • 2×8 Configuration with 2.54 mm Channel Pitch
  • 16 Individual 1.85 mm Female Breakout Interfaces
  • Phase Matching: ±2 ps
  • ≥500 Mating Cycles
  • Custom Cable Assembly Lengths Available
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Product overview

VST-TE70FF116C-XXX is a 16-channel high-density multi-coax breakout cable assembly operating from DC to 67 GHz. Its 2×8 TE70 interface connects to 16 individual 1.85 mm female breakout ports for board-level and multi-channel RF test connections.

Technical specifications

Configuration & interfaces
Channel count 16 coaxial channels
Multi-coax interface TE70, 2×8 configuration
Breakout interfaces 16 × 1.85 mm female
Channel pitch 2.54 mm
Cable assembly length Custom length, specified in mm
Electrical performance
Frequency range DC–67 GHz
Nominal impedance 50 Ω per coaxial channel
Return loss ≥ 10 dB
Insertion loss ≤ (11.5 × L / 1000) + 1.2 dB (L = assembly length in mm)
Phase matching ±2 ps
Test voltage 300 Vrms
Mechanical & environmental specifications
Mechanical life ≥ 500 cycles
Operating temperature 0 °C to +85 °C
RoHS Compliant
Materials & finishes
TE70 shell Aluminum, anodized
TE70 center contact Beryllium copper, gold plated
TE70 outer contact Beryllium copper, gold plated
TE70 insulator PEEK
1.85 mm center contact Beryllium copper, gold plated
1.85 mm outer contact Stainless steel, passivated
1.85 mm insulator PEI
Other metallic parts Stainless steel, passivated

Test data

The datasheet includes representative mixed-mode measurements from 10 MHz to 67 GHz: Sdd11 / Sdd22 for differential return loss and Sdd21 / Sdd12 for differential insertion loss. These results apply to the tested assembly and configuration; actual performance varies with cable length and configuration. Individual test data are available on request.

Configuration & PCB integration

Specify the required assembly length, channel mapping and phase-matching requirements for the test setup. Verify the TE70 mating interface, mounting features and recommended PCB layout against the product drawing before board integration.

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